iCrowd Newswire
17 Sep 2021, 03:33 GMT+10
Opportunities in the 3D TSV and 2.5D market have evolved through a number of stages. Lucintel has found the future of this market to be promising; the 3D TSV and 2.5D market is expected to grow at a CAGR of 32% to 34%. In this market, CIS with TSV is expected to remain the largest packaging type, and consumer electronics segment is expected to remain the largest end use industy. Players can benefit from the available opportunities like increasing smartphone adoption rates have made Asia-Pacific one of the largest mobile markets in the world.
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Taiwan Semiconductor Manufacturing Company, Samsung Electronics, Toshiba, ASE Group, and Amkor Technology are some of the companies profiled in this report.
Some of the features of this report:
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This exclusive report from Lucintel will enable you to make confident business decisions in this globally competitive marketplace. For a detailed table of contents, contact Lucintel at +1-972-636-5056 or click on this link [email protected]
About Lucintel
Lucintel, the premier global management consulting and market research firm, creates winning strategies for growth. It offers market assessments, competitive analysis, opportunity analysis, growth consulting, M&A, and due diligence services to executives and key decision-makers in a variety of industries. For further information, visit www.lucintel.com.
Brandon Fitzgerald Lucintel Dallas, Texas, USA Email: [email protected] Tel. 972.636.5056 Cell: 303.775.0751
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Tags: 3D Tsv And 2.5D market, 3D Tsv And 2.5D industry, covid 19 impact on 3D Tsv And 2.5D market
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